25 th IAPRI Symposium on Packaging
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منابع مشابه
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An advanced substrate level patterning technique is presented to realize 3D interconnection circuitry on electronic modules. The technique is based on diffraction of light by phase gratings. The phase gratings are incorporated into the photomask at discrete locations. By illuminating the photomask at normal incidence, the phase grating causes locally inclined UV exposure, which is used to expos...
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As a promising nonvolatile memory technology, Phase Change Memory (PCM) has many advantages over traditional DRAM. Multilevel Cell PCM (MLC) has the benefit of increased memory capacity with low fabrication cost. Due to high per-cell write power and long write latency, MLC PCM requires careful power management to ensure write reliability. Unfortunately, existing power management schemes applied...
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ژورنال
عنوان ژورنال: Seikei-Kakou
سال: 2011
ISSN: 0915-4027,1883-7417
DOI: 10.4325/seikeikakou.23.624